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Role of process parameters on bondability and pad damage indicators in copper ball bonding.
I. Qin
Aashish Shah
C. Huynh
M. Meyer
M. Mayer
Y. Zhou
Published in:
Microelectron. Reliab. (2011)
Keyphrases
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database
wire bonding
parameter adjustment
genetic algorithm
parameter settings
parameter values
parameter estimation
multi agent systems
input data
multiresolution
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multi agent
image segmentation
decision making
information systems
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databases