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J. T. Moon
Publication Activity (10 Years)
Years Active: 2009-2013
Publications (10 Years): 0
Top Topics
Ultrasound Images
Wire Bonding
Bond Pad
Design Parameters
Top Venues
Microelectron. Reliab.
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Publications
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Alireza Rezvani
,
Aashish Shah
,
M. Mayer
,
Y. Zhou
,
J. T. Moon
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.
Microelectron. Reliab.
53 (7) (2013)
Wan Ho Song
,
Michael Mayer
,
Y. Zhou
,
S. H. Kim
,
J. S. Hwang
,
J. T. Moon
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.
Microelectron. Reliab.
52 (11) (2012)
Jae-sik Lee
,
Michael Mayer
,
Y. Zhou
,
J. T. Moon
,
John Persic
Influence of gold pick up on the hardness of copper free air ball.
Microelectron. Reliab.
51 (1) (2011)
Aashish Shah
,
Alireza Rezvani
,
M. Mayer
,
Y. Zhou
,
John Persic
,
J. T. Moon
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.
Microelectron. Reliab.
51 (1) (2011)
A. Pequegnat
,
H. J. Kim
,
M. Mayer
,
Y. Zhou
,
John Persic
,
J. T. Moon
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.
Microelectron. Reliab.
51 (1) (2011)
Jae-sik Lee
,
Michael Mayer
,
Y. Zhou
,
S. J. Hong
,
J. T. Moon
Silver pick up during tail formation in thermosonic wire bonding process.
Microelectron. Reliab.
51 (1) (2011)
M. Mayer
,
J. T. Moon
,
John Persic
Measuring stress next to Au ball bond during high temperature aging.
Microelectron. Reliab.
49 (7) (2009)