J. S. Hwang

Publication Activity (10 Years)

Years Active: 1992-2012
Publications (10 Years): 0

Top Topics

Ultrasound Images

Bayesian Networks

Design Parameters

Top Venues

Microelectron. Reliab.

Publications

Wan Ho Song, Michael Mayer, Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. Microelectron. Reliab. 52 (11) (2012)
J. S. Hwang, M. J. Yim, K. W. Paik
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application. Microelectron. Reliab. 48 (2) (2008)
J. S. Hwang
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs. Microelectron. Reliab. 48 (4) (2008)
J. S. Hwang
Rational approximation to orthogonal bases and of the solutions of elliptic equations. Numerische Mathematik 81 (4) (1999)
J. S. Hwang
Interference-free tool-path generation in the NC machining of parametric compound surfaces. Comput. Aided Des. 24 (12) (1992)