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Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application.
J. S. Hwang
M. J. Yim
K. W. Paik
Published in:
Microelectron. Reliab. (2008)
Keyphrases
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high speed
desirable properties
rf sputtering
low cost
operating system
low power
film thickness