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Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.

Alireza RezvaniAashish ShahM. MayerY. ZhouJ. T. Moon
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • wire bonding
  • bond pad
  • stress response
  • ultrasound images
  • database
  • real time
  • image analysis
  • medical images
  • optimization algorithm