Alireza Rezvani

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 7

Top Topics

Matlab Simulink

Top Venues

Neural Comput. Appl.

Microelectron. Reliab.

Comput. Biol. Chem.

Publications

Elaheh Movahedi, Hafez Razmazma, Alireza Rezvani, Ali Ebrahimi
Binding profile of a mixed-ligand silver(I) complex with DNA and Topoisomerase I. Comput. Biol. Chem. 103 (2023)
Abdallah Aldosary, Muhyaddin Jamal H. Rawa, Ziad M. Ali, Mohsen Latifi, Armin Razmjoo, Alireza Rezvani
Energy management strategy based on short-term resource scheduling of a renewable energy-based microgrid in the presence of electric vehicles using θ-modified krill herd algorithm. Neural Comput. Appl. 33 (16) (2021)
Di Wu, Goran Saman Nariman, Salim Qadir Mohammed, Zehui Shao, Alireza Rezvani, Saeed Mohajeryami
Modeling and simulation of novel dynamic control strategy for PV-wind hybrid power system using FGS-PID and RBFNSM methods. Soft Comput. 24 (11) (2020)
Seyed Mohammad Hassan Hosseini, Alireza Rezvani
Modeling and simulation to optimize direct power control of DFIG in variable-speed pumped-storage power plant using teaching-learning-based optimization technique. Soft Comput. 24 (22) (2020)
Mehrdad Khaksar, Alireza Rezvani, Mohammad Hassan Moradi
Simulation of novel hybrid method to improve dynamic responses with PSS and UPFC by fuzzy logic controller. Neural Comput. Appl. 29 (3) (2018)
Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. Microelectron. Reliab. 73 (2017)
Alireza Rezvani, Majid Gandomkar
Simulation and control of intelligent photovoltaic system using new hybrid fuzzy-neural method. Neural Comput. Appl. 28 (9) (2017)
Alireza Rezvani, Aashish Shah, M. Mayer, Y. Zhou, J. T. Moon
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53 (7) (2013)
Aashish Shah, Alireza Rezvani, M. Mayer, Y. Zhou, John Persic, J. T. Moon
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51 (1) (2011)