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Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding.
Ari Laor
Depayne Athia
Alireza Rezvani
Horst Clauberg
Michael Mayer
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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high density
sensor array
analog vlsi
high speed
low cost
circuit design
cmos image sensor
random access memory
ultra low power
chip design
single chip
low power
image sensor
data center
power supply
image compression
image processing
field effect transistors
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