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C. J. Hang
Publication Activity (10 Years)
Years Active: 2008-2011
Publications (10 Years): 0
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Publications
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Y. H. Tian
,
C. J. Hang
,
C. Q. Wang
,
G. Q. Ouyang
,
D. S. Yang
,
J. P. Zhao
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.
Microelectron. Reliab.
51 (1) (2011)
C. J. Hang
,
C. Q. Wang
,
M. Mayer
,
Y. H. Tian
,
Y. Zhou
,
H. H. Wang
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectron. Reliab.
48 (3) (2008)