C. Q. Wang

Publication Activity (10 Years)

Years Active: 2006-2011
Publications (10 Years): 0

Publications

Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectron. Reliab. 51 (1) (2011)
C. J. Hang, C. Q. Wang, M. Mayer, Y. H. Tian, Y. Zhou, H. H. Wang
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48 (3) (2008)
H. T. Chen, C. Q. Wang, M. Y. Li
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. Microelectron. Reliab. 46 (8) (2006)