Y. H. Tian

Publication Activity (10 Years)

Years Active: 2008-2022
Publications (10 Years): 1

Top Topics

Optimization Model

Top Venues

Microelectron. J.

Publications

S. Cong, W. W. Zhang, P. Liu, Y. N. Han, Y. H. Tian
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. Microelectron. J. 121 (2022)
Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectron. Reliab. 51 (1) (2011)
C. J. Hang, C. Q. Wang, M. Mayer, Y. H. Tian, Y. Zhou, H. H. Wang
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48 (3) (2008)