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Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.

Y. H. TianC. J. HangC. Q. WangG. Q. OuyangD. S. YangJ. P. Zhao
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • data analysis
  • statistical analysis
  • quantitative analysis
  • highly reliable
  • neural network
  • real world
  • natural language
  • automatic analysis