D. S. Yang

Publication Activity (10 Years)

Years Active: 2011-2011
Publications (10 Years): 0

Publications

Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectron. Reliab. 51 (1) (2011)