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L. Dupont
Publication Activity (10 Years)
Years Active: 2006-2014
Publications (10 Years): 0
Top Topics
Bi Directional
User Behaviour
High Temperature
Environmental Conditions
Top Venues
Microelectron. Reliab.
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Publications
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Son-Ha Tran
,
L. Dupont
,
Zoubir Khatir
Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions.
Microelectron. Reliab.
54 (9-10) (2014)
Y. Celnikier
,
L. Dupont
,
E. Hervé
,
Gerard Coquery
,
Lahouari Benabou
Optimization of wire connections design for power electronics.
Microelectron. Reliab.
51 (9-11) (2011)
Y. Celnikier
,
Lahouari Benabou
,
L. Dupont
,
Gerard Coquery
Investigation of the heel crack mechanism in Al connections for power electronics modules.
Microelectron. Reliab.
51 (5) (2011)
L. Dupont
,
J. L. Blanchard
,
Richard Lallemand
,
Gerard Coquery
,
Jean-Michel Morelle
,
G. Blondel
,
B. Rouleau
Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode.
Microelectron. Reliab.
50 (9-11) (2010)
Zoubir Khatir
,
L. Dupont
,
Ali Ibrahim
Investigations on junction temperature estimation based on junction voltage measurements.
Microelectron. Reliab.
50 (9-11) (2010)
L. Dupont
,
Gerard Coquery
,
K. Kriegel
,
A. Melkonyan
Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application.
Microelectron. Reliab.
49 (9-11) (2009)
L. Dupont
,
Stéphane Lefebvre
,
M. Bouaroudj
,
Zoubir Khatir
,
Jean-Claude Faugières
Failure modes on low voltage power MOSFETs under high temperature application.
Microelectron. Reliab.
47 (9-11) (2007)
M. Bouarroudj
,
Zoubir Khatir
,
Jean-Pierre Ousten
,
F. Badel
,
L. Dupont
,
Stéphane Lefebvre
Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions.
Microelectron. Reliab.
47 (9-11) (2007)
L. Dupont
,
Zoubir Khatir
,
Stéphane Lefebvre
,
S. Bontemps
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling.
Microelectron. Reliab.
46 (9-11) (2006)