Jean-Pierre Ousten

Publication Activity (10 Years)

Years Active: 2001-2018
Publications (10 Years): 3

Top Topics

Electronic Devices

High Temperature

Structuring Elements

Top Venues

Microelectron. Reliab.

Publications

Malika Elharizi, Fadi Zaki, Ali Ibrahim, Zoubir Khatir, Jean-Pierre Ousten
/AlGaN/GaN normally-ON devices. Microelectron. Reliab. (2018)
Nausicaa Dornic, Ali Ibrahim, Zoubir Khatir, Son-Ha Tran, Jean-Pierre Ousten, Jeffrey Ewanchuk, Stefan Mollov
Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling. Microelectron. Reliab. (2018)
Ali Ibrahim, Jean-Pierre Ousten, Richard Lallemand, Zoubir Khatir
Power cycling issues and challenges of SiC-MOSFET power modules in high temperature conditions. Microelectron. Reliab. 58 (2016)
Jean-Pierre Ousten, Zoubir Khatir
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications. Microelectron. Reliab. 51 (9-11) (2011)
M. Bouarroudj, Zoubir Khatir, Jean-Pierre Ousten, F. Badel, L. Dupont, Stéphane Lefebvre
Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions. Microelectron. Reliab. 47 (9-11) (2007)
Gerard Coquery, S. Carubelli, Jean-Pierre Ousten, Richard Lallemand, Frederic Lecoq, Dominique Lhotellier, V. de Viry, Philippe Dupuy
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter. Microelectron. Reliab. 41 (9-10) (2001)