Giovanni Fiorenza

Publication Activity (10 Years)

Years Active: 2003-2008
Publications (10 Years): 0

Publications

Henry H. K. Tang, Conal E. Murray, Giovanni Fiorenza, Kenneth P. Rodbell, Michael S. Gordon, David F. Heidel
New simulation methodology for effects of radiation in semiconductor chip structures. IBM J. Res. Dev. 52 (3) (2008)
Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
Impact of interconnect length changes on effective materials properties (dielectric constant). SLIP (2007)
Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements. IBM J. Res. Dev. 49 (4-5) (2005)
Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
Predicting interconnect requirements in ultra-large-scale integrated control logic circuitry. SLIP (2005)
Gerald G. Lopez, Giovanni Fiorenza, Thomas J. Bucelot, Phillip J. Restle, Mary Yvonne Lanzerotti
Characterization of the impact of interconnect design on the capacitive load driven by a global clock distribution. ACM Great Lakes Symposium on VLSI (2005)
Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
Interpretation of rent's rule for ultralarge-scale integrated circuit designs, with an application to wirelength distribution models. IEEE Trans. Very Large Scale Integr. Syst. 12 (12) (2004)
Mary Yvonne Lanzerotti, Giovanni Fiorenza, Rick A. Rand
Assessment of on-chip wire-length distribution models. IEEE Trans. Very Large Scale Integr. Syst. 12 (10) (2004)
Mary Y. L. Wisniewski, Emmanuel Yashchin, Robert L. Franch, David P. Conrady, Daniel N. Maynard, Giovanni Fiorenza, I. Cevdet Noyan
The physical design of on-chip interconnections. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 22 (3) (2003)
Mary Y. L. Wisniewski, Emmanuel Yashchin, Robert L. Franch, David P. Conrady, Giovanni Fiorenza, I. Cevdet Noyan
Estimating the efficiency of collaborative problem-solving, with applications to chip design. IBM J. Res. Dev. 47 (1) (2003)