Caleb Serafy

Publication Activity (10 Years)

Years Active: 2013-2019
Publications (10 Years): 9

Top Topics

Driven Learning

Buffer Overflow

Multicore Processors

Top Venues

ACM Great Lakes Symposium on VLSI

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava
Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (11) (2019)
Caleb Serafy, Zhiyuan Yang, Ankur Srivastava
Design Space Modeling and Simulation for Physically Constrained 3D CPUs. ACM Great Lakes Symposium on VLSI (2017)
Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava
TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (10) (2017)
Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava
Phase-driven Learning-based Dynamic Reliability Management For Multi-core Processors. DAC (2017)
Zhiyuan Yang, Caleb Serafy, Ankur Srivastava
ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling. FCCM (2016)
Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks. IEEE Des. Test 33 (2) (2016)
Yang Xie, Chongxi Bao, Caleb Serafy, Tiantao Lu, Ankur Srivastava, Mark M. Tehranipoor
Security and Vulnerability Implications of 3D ICs. IEEE Trans. Multi Scale Comput. Syst. 2 (2) (2016)
Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling. IEEE Trans. Very Large Scale Integr. Syst. 24 (4) (2016)
Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Ankur Srivastava
Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUs. ISLPED (2016)
Caleb Serafy, Ankur Srivastava
TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34 (4) (2015)
Caleb Serafy, Ankur Srivastava, Donald Yeung
Unlocking the true potential of 3D CPUs with micro-fluidic cooling. ISLPED (2014)
Caleb Serafy, Ankur Srivastava
Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts. ISPD (2014)
Caleb Serafy, Bing Shi, Ankur Srivastava
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. Integr. 47 (3) (2014)
Bing Shi, Caleb Serafy, Ankur Srivastava
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. ACM Great Lakes Symposium on VLSI (2013)
Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung
High performance 3D stacked DRAM processor architectures with micro-fluidic cooling. 3DIC (2013)
Caleb Serafy, Ankur Srivastava
Online TSV health monitoring and built-in self-repair to overcome aging. DFTS (2013)
Caleb Serafy, Bing Shi, Ankur Srivastava
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. ACM Great Lakes Symposium on VLSI (2013)