TSV-Based 3-D ICs: Design Methods and Tools.
Tiantao LuCaleb SerafyZhiyuan YangSandeep Kumar SamalSung Kyu LimAnkur SrivastavaPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2017)
Keyphrases
- benchmark datasets
- software tools
- statistical methods
- machine learning methods
- significant improvement
- computational cost
- empirical studies
- building blocks
- methodological framework
- database
- visualization tools
- machine learning algorithms
- user interface
- high dimensional
- search algorithm
- computer vision
- search engine
- real time