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Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.
Caleb Serafy
Bing Shi
Ankur Srivastava
Published in:
ACM Great Lakes Symposium on VLSI (2013)
Keyphrases
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low cost
high density
high speed
scale space
geometric structure
geometric features
database
data sets
three dimensional
data reduction
scale invariant
reduction method
circuit design
physical design
analog vlsi
geometric and photometric transformations