Avram Bar-Cohen

Publication Activity (10 Years)

Years Active: 1985-2016
Publications (10 Years): 1

Top Topics

Numerical Simulations

Integrated Circuit

Simulated Annealing

Top Venues

IET Circuits Devices Syst.

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling. IEEE Trans. Very Large Scale Integr. Syst. 24 (4) (2016)
Bing Shi, Ankur Srivastava, Avram Bar-Cohen
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. IET Circuits Devices Syst. 7 (5) (2013)
Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver
Life prediction of LED-based recess downlight cooled by synthetic jet. Microelectron. Reliab. 52 (5) (2012)
Bing Shi, Ankur Srivastava, Avram Bar-Cohen
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. ISVLSI (2012)
Avram Bar-Cohen, Mehmet Arik, M. Ohadi
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components. Proc. IEEE 94 (8) (2006)
Avram Bar-Cohen
Bounding relations for natural convection heat transfer from vertical printed circuit boards. Proc. IEEE 73 (9) (1985)