Bounding relations for natural convection heat transfer from vertical printed circuit boards.
Avram Bar-CohenPublished in: Proc. IEEE (1985)
Keyphrases
- heat transfer
- printed circuit boards
- numerical simulations
- heat exchanger
- temperature field
- fluid flow
- mathematical models
- finite element method
- natural gas
- thermal conductivity
- computational fluid dynamics
- visual inspection
- manufacturing process
- integrated circuit
- finite element
- computer vision
- surface defects
- partial differential equations
- case study
- artificial intelligence