Bongtae Han

Publication Activity (10 Years)

Years Active: 2005-2022
Publications (10 Years): 5

Top Topics

Behavior Patterns

Fault Detection

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Electron.

Publications

Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Guo Qi Zhang
Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. IEEE Trans. Ind. Electron. 69 (3) (2022)
Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. Microelectron. Reliab. 78 (2017)
Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor. Microelectron. Reliab. 74 (2017)
Kenny Mahan, Byung Kim, Bulong Wu, Bongtae Han, Ilho Kim, Hojeong Moon, Young Nam Hwang
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. Microelectron. Reliab. 63 (2016)
Alicja Palczynska, Przemyslaw Jakub Gromala, Dirk Mayer, Bongtae Han, Tobias Melz
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor. Microelectron. Reliab. 62 (2016)
Dae-Suk Kim, Bongtae Han, Youn-Jea Kim
Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire. Microelectron. Reliab. 54 (1) (2014)
Bong-Min Song, Bongtae Han, Joon-Hyun Lee
Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. Microelectron. Reliab. 53 (3) (2013)
Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver
Life prediction of LED-based recess downlight cooled by synthetic jet. Microelectron. Reliab. 52 (5) (2012)
Bongtae Han
Measurements of True Leak Rates of MEMS Packages. Sensors 12 (3) (2012)
Changsoo Jang, Byeng Dong Youn, Ping F. Wang, Bongtae Han, Suk-Jin Ham
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. Microelectron. Reliab. 50 (4) (2010)
Arindam Goswami, Bongtae Han
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes. Microelectron. Reliab. 48 (11-12) (2008)
Jinwon Joo, Seungmin Cho, Bongtae Han
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectron. Reliab. 45 (3-4) (2005)