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Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit.
Bing Shi
Ankur Srivastava
Avram Bar-Cohen
Published in:
IET Circuits Devices Syst. (2013)
Keyphrases
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integrated circuit
heat transfer
three dimensional
thermal conductivity
numerical simulations
metal oxide semiconductor
electrical power
finite element method
mathematical models
x ray
high density
image sequences
high speed
data transmission
electron beam
infrared
power system
low cost
real time