André Zimmermann

Publication Activity (10 Years)

Years Active: 2017-2024
Publications (10 Years): 19

Top Topics

Reliability Assessment

Development Processes

Error Diffusion

Top Venues

IEEE Trans. Instrum. Meas.

Microelectron. Reliab.

Publications

Faruk Civelek, Alexander Brem, Karl-Peter Fritz, André Zimmermann
Product Development Processes for Individualized Products: A Case Study. IEEE Trans. Engineering Management 71 (2024)
Daniela Walter, André Bülau, André Zimmermann
Review on Excess Noise Measurements of Resistors. Sensors 23 (3) (2023)
Monika Elisabeth Heringhaus, Yi Zhang, André Zimmermann, Lars Mikelsons
Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference. Sensors 22 (14) (2022)
Jonas Jäger, Adrian Schwenck, Daniela Walter, André Bülau, Kerstin Gläser, André Zimmermann
Inkjet-Printed Temperature Sensors Characterized according to Standards. Sensors 22 (21) (2022)
Monika Elisabeth Heringhaus, Alexander Buhmann, Jürgen Müller, André Zimmermann
Graph neural networks for parameter estimation in micro-electro-mechanical system testing. Array 14 (2022)
Michael Haub, Martin Bogner, Thomas Günther, André Zimmermann, Hermann Sandmaier
Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning. Sensors 21 (11) (2021)
Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann
Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. Sensors 21 (16) (2021)
Adrian Schwenck, Thomas Günther, André Zimmermann
Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor. Sensors 21 (23) (2021)
Benedikt Wigger, Ingo Koinzer, Thomas Meissner, Maximilian Barth, André Zimmermann
Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns. Robotics Comput. Integr. Manuf. 63 (2020)
Martin Trotter, Daniel Juric, Zahra Bagherian, Nadine Borst, Kerstin Gläser, Thomas Meissner, Felix von Stetten, André Zimmermann
Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications. Sensors 20 (5) (2020)
Volker Kible, Robson Nunes de Lima, Karolinne B. Brito, André Bülau, André Zimmermann
Quadrature Block for UHF Reflection Coefficient Measurements Using a Directional Coupler and Injection Locking. IEEE Trans. Instrum. Meas. 69 (1) (2020)
Alaa Fezai, Anuj Sharma, Wolfgang Müller-Hirsch, André Zimmermann
Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques. IEEE Trans. Instrum. Meas. 69 (7) (2020)
Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, André Zimmermann
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation. IEEE Access 7 (2019)
Lukas Lamprecht, Ricardo Ehrenpfordt, Tobias Zoller, André Zimmermann
Application of human motion energy harvesters on industrial linear technology. IET Wirel. Sens. Syst. 9 (2) (2019)
Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann
Effect of Joule heating on the reliability of solder joints under power cycling conditions. Microelectron. Reliab. (2018)
Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectron. Reliab. 85 (2018)
Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann
Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB. IEEE Access 6 (2018)
Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. IEEE Trans. Reliab. 66 (4) (2017)
Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 17 (7) (2017)