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Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.

Paul WildTobias GrözingerDominik LorenzAndré Zimmermann
Published in: IEEE Trans. Reliab. (2017)
Keyphrases
  • high density
  • printed circuit boards
  • infrared
  • databases
  • decision making
  • special case
  • negative impact
  • database
  • data mining
  • artificial intelligence
  • feature selection
  • control system
  • thin film
  • visual inspection