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A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation.

Mahdi SoltaniRomit KulkarniTobias ScheinostTobias GroezingerAndré Zimmermann
Published in: IEEE Access (2019)
Keyphrases
  • reliability analysis
  • data sets
  • high speed
  • flow analysis
  • data analysis
  • statistical analysis
  • mathematical model
  • decision making
  • numerical analysis
  • learning algorithm
  • case study
  • image analysis
  • numerical simulations