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Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.
Paul Wild
Dominik Lorenz
Tobias Grözinger
André Zimmermann
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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high density
high speed
reliability assessment
low cost
mathematical model
simulation environment
failure rate
finite element model
analog vlsi
neural network
simulation model
reliability analysis
programmable logic