Fast filling of through-silicon via (TSV) with conductive polymer/metal composites.

Jin Kawakita Barbara Horváth Toyohiro Chikyow

Published in: 3DIC (2015)

Keyphrases

si sio
metal oxide
field effect transistors
x ray
solid state
chemical vapor deposition
high temperature
high speed
space charge
composite materials
silicon dioxide
steady state
high density
grain size
semiconductor devices
databases
image inpainting
texture synthesis
data mining