Barbara Horváth

Publication Activity (10 Years)

Years Active: 2013-2015
Publications (10 Years): 1

Top Topics

Shape Variations

Innovation Diffusion

Semiconductor Devices

Top Venues

Microelectron. Reliab.

Publications

Jin Kawakita, Barbara Horváth, Toyohiro Chikyow
Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. 3DIC (2015)
Balázs Illés, Barbara Horváth
Whiskering behaviour of immersion tin surface coating. Microelectron. Reliab. 53 (5) (2013)
Barbara Horváth
Influence of copper diffusion on the shape of whiskers grown on bright tin layers. Microelectron. Reliab. 53 (7) (2013)