Built-in self-test for manufacturing TSV defects before bonding.
Giorgio Di NataleMarie-Lise FlottesBruno RouzeyreHakim ZimouchePublished in: VTS (2014)
Keyphrases
- built in self test
- printed circuit boards
- integrated circuit
- quality control
- manufacturing systems
- automated visual inspection
- manufacturing processes
- manufacturing process
- production process
- manufacturing environment
- operations management
- manufacturing industry
- defect detection
- product design
- production planning
- defect classification
- databases
- process planning
- case study
- information systems
- data mining
- software development
- supply chain
- multi agent systems
- data structure
- multiscale
- cell formation
- industrial engineering
- concurrent engineering
- artificial intelligence