Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning.
Chih-han HsuShanq-Jang RuanYing-Jung ChenTsang-Chi KanPublished in: ISQED (2013)
Keyphrases
- high density
- infrared
- signal processing
- reliability analysis
- hough transform
- low cost
- charge coupled device
- signal detection
- integrated circuit
- line segments
- non stationary
- high speed
- power plant
- axis parallel
- original signal
- electrical properties
- high frequency
- compressive sensing
- thermal images
- silicon dioxide
- genetic algorithm
- gate dielectrics