Zhong Chen

Publication Activity (10 Years)

Years Active: 2009-2024
Publications (10 Years): 4

Top Topics

Mechanical Properties

High Temperature

Electronic Business

Top Venues

Microelectron. Reliab.

Publications

Ten It Wong, Candy Ng, Shengxuan Lin, Zhong Chen, Xiaodong Zhou
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer. Sensors 24 (9) (2024)
Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectron. Reliab. 63 (2016)
Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition. Microelectron. Reliab. 56 (2016)
Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts. Microelectron. Reliab. 60 (2016)
Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectron. Reliab. 54 (11) (2014)
Ahmed Sharif, Chee Lip Gan, Zhong Chen
Customized glass sealant for ceramic substrates for high temperature electronic application. Microelectron. Reliab. 54 (12) (2014)
A. S. Ganapathi, Sunil C. Joshi, Zhong Chen
Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties. Simul. Model. Pract. Theory 32 (2013)
H. Xu, C. Liu, Vadim V. Silberschmidt, Zhong Chen, J. Wei, M. Sivakumar
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. Microelectron. Reliab. 51 (1) (2011)
Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectron. Reliab. 49 (2) (2009)