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Zhong Chen
ORCID
Publication Activity (10 Years)
Years Active: 2009-2024
Publications (10 Years): 4
Top Topics
Mechanical Properties
High Temperature
Electronic Business
Wire Bonding
Top Venues
Microelectron. Reliab.
Sensors
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Publications
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Ten It Wong
,
Candy Ng
,
Shengxuan Lin
,
Zhong Chen
,
Xiaodong Zhou
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer.
Sensors
24 (9) (2024)
Adeline B. Y. Lim
,
Chris B. Boothroyd
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.
Microelectron. Reliab.
63 (2016)
Adeline B. Y. Lim
,
Wei Jian Neo
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.
Microelectron. Reliab.
56 (2016)
Vinod K. Murugan
,
Zhigang Jia
,
Govindo J. Syaranamual
,
Chee Lip Gan
,
Yizhong Huang
,
Zhong Chen
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.
Microelectron. Reliab.
60 (2016)
Adeline B. Y. Lim
,
Andrew C. K. Chang
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
Microelectron. Reliab.
54 (11) (2014)
Ahmed Sharif
,
Chee Lip Gan
,
Zhong Chen
Customized glass sealant for ceramic substrates for high temperature electronic application.
Microelectron. Reliab.
54 (12) (2014)
A. S. Ganapathi
,
Sunil C. Joshi
,
Zhong Chen
Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties.
Simul. Model. Pract. Theory
32 (2013)
H. Xu
,
C. Liu
,
Vadim V. Silberschmidt
,
Zhong Chen
,
J. Wei
,
M. Sivakumar
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
Microelectron. Reliab.
51 (1) (2011)
Xuefen Ong
,
Soon Wee Ho
,
Yue Ying Ong
,
Leong Ching Wai
,
Kripesh Vaidyanathan
,
Yeow Kheng Lim
,
David Yeo
,
Kai Chong Chan
,
Juan Boon Tan
,
Dong Kyun Sohn
,
Liang Choo Hsia
,
Zhong Chen
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectron. Reliab.
49 (2) (2009)