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Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
Adeline B. Y. Lim
Andrew C. K. Chang
Oranna Yauw
Bob Chylak
Chee Lip Gan
Zhong Chen
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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wire bonding
parameter estimation
sensitivity analysis
neural network
image segmentation
high speed
parameter settings
input parameters
design parameters
maximum likelihood