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Adeline B. Y. Lim
Publication Activity (10 Years)
Years Active: 2014-2016
Publications (10 Years): 2
Top Topics
Wire Bonding
Mechanical Properties
Evaluation Process
Bond Pad
Top Venues
Microelectron. Reliab.
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Publications
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Adeline B. Y. Lim
,
Chris B. Boothroyd
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.
Microelectron. Reliab.
63 (2016)
Adeline B. Y. Lim
,
Wei Jian Neo
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.
Microelectron. Reliab.
56 (2016)
Adeline B. Y. Lim
,
Andrew C. K. Chang
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
Microelectron. Reliab.
54 (11) (2014)