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Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.

Adeline B. Y. LimChris B. BoothroydOranna YauwBob ChylakChee Lip GanZhong Chen
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • evolutionary algorithm
  • wire bonding
  • bond pad
  • stress response
  • spatial distribution
  • data distribution
  • learning algorithm
  • probability distribution
  • steady state
  • numerical simulations
  • mechanical properties