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Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen OngSoon Wee HoYue Ying OngLeong Ching WaiKripesh VaidyanathanYeow Kheng LimDavid YeoKai Chong ChanJuan Boon TanDong Kyun SohnLiang Choo HsiaZhong Chen
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • selection algorithm
  • data structure
  • coarse to fine
  • high levels
  • feature selection
  • objective function
  • theoretical framework
  • fine tuning
  • selection mechanism