Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Xuefen OngSoon Wee HoYue Ying OngLeong Ching WaiKripesh VaidyanathanYeow Kheng LimDavid YeoKai Chong ChanJuan Boon TanDong Kyun SohnLiang Choo HsiaZhong ChenPublished in: Microelectron. Reliab. (2009)