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Miji Lee
Publication Activity (10 Years)
Years Active: 2015-2020
Publications (10 Years): 4
Top Topics
Low Cost
Volumetric Data
Cmos Image Sensor
Anomaly Detection
Top Venues
IRPS
Ind. Manag. Data Syst.
Int. J. Asian Bus. Inf. Manag.
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Publications
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Tae-Young Jeong
,
Miji Lee
,
Yunkyung Jo
,
Jinwoo Kim
,
Min Kim
,
Myungsoo Yeo
,
Jinseok Kim
,
Hyunjun Choi
,
Joosung Kim
,
Yoojin Jo
,
Yongsung Ji
,
Taiki Uemura
,
Hai Jiang
,
Dongkyun Kwon
,
HwaSung Rhee
,
Sangwoo Pae
,
Brandon Lee
Reliability on EUV Interconnect Technology for 7nm and beyond.
IRPS
(2020)
U. Jin Baek
,
Miji Lee
,
Jongtae Lee
A Study on Linguistic Management in Online and Offline Communities: Focusing on the Effect of Jargons on the Conflict.
Int. J. Asian Bus. Inf. Manag.
10 (2) (2019)
Younggeun Ji
,
Jeonghoon Kim
,
Jungin Kim
,
Miji Lee
,
Jaeheon Noh
,
Taeyoung Jeong
,
Juhyeon Shin
,
Junho Kim
,
Young Heo
,
Ung Cho
,
Hyun-Chul Sagong
,
Junekyun Park
,
Yeonsik Choo
,
Gilhwan Do
,
Hoyoung Kang
,
Eunkyeong Choi
,
Dongyoon Sun
,
Changki Kang
,
Sangchul Shin
,
Sangwoo Pae
Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.
IRPS
(2018)
Taehoon Ko
,
Je Hyuk Lee
,
Hyunchang Cho
,
Sungzoon Cho
,
Wounjoo Lee
,
Miji Lee
Machine learning-based anomaly detection via integration of manufacturing, inspection and after-sales service data.
Ind. Manag. Data Syst.
117 (5) (2017)
Jongwoo Park
,
Miji Lee
,
Kyunghwan Min
,
J.-K. Choi
,
Changkyu Joo
,
S.-C. Park
,
Hanbyul Kang
,
Sangwoo Pae
Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation.
IRPS
(2015)
Jongwoo Park
,
Miji Lee
,
Hanbyul Kang
,
Wooram Ko
,
Eunkyeong Choi
,
Junsik Im
,
Minwoo Lee
,
Dohwan Chung
,
Jinchul Park
,
Sangchul Shin
,
Sangwoo Pae
Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism.
IRPS
(2015)
Jongwoo Park
,
Jungpyo Hong
,
Miji Lee
,
Dongyoon Sun
,
Kyung Kang
,
Taesung Kim
,
Seungwon Kim
,
Sujin Kwon
,
Changkyu Joo
,
Sangsu Ha
,
Wooyeon Kim
,
Jongsu Ryu
,
Sangwoo Pae
Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.
IRPS
(2015)