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Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.

Jongwoo ParkJungpyo HongMiji LeeDongyoon SunKyung KangTaesung KimSeungwon KimSujin KwonChangkyu JooSangsu HaWooyeon KimJongsu RyuSangwoo Pae
Published in: IRPS (2015)
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