Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.
Jongwoo ParkJungpyo HongMiji LeeDongyoon SunKyung KangTaesung KimSeungwon KimSujin KwonChangkyu JooSangsu HaWooyeon KimJongsu RyuSangwoo PaePublished in: IRPS (2015)
Keyphrases
- low cost
- low power
- low power consumption
- hardware and software
- high reliability
- cost effective
- embedded systems
- transmission line
- real time
- electron microscopy
- mechanical properties
- digital camera
- single chip
- low energy
- high speed
- highly efficient
- scientific computing
- hardware software co design
- artificial intelligence
- learning algorithm
- database