M. H. Lin

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 4

Top Topics

Arc Consistency

Top Venues

Publications

Y. H. Lin, C. C. Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. IRPS (2023)
M. H. Lin, C. I. Lin, Y. C. Wang, Aaron Wang
Redundancy Effect on Electromigration Failure Time in Power Grid Networks. IRPS (2022)
M. H. Lin, W. S. Chou, Y. T. Yang, A. S. Oates
Characterization of Critical Peak Current and General Model of Interconnect Systems Under Short Pulse-Width Conditions. IRPS (2019)
M. H. Lin, A. S. Oates
Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. IRPS (2015)
M. H. Lin, M. T. Lin, Tahui Wang
Effects of length scaling on electromigration in dual-damascene copper interconnects. Microelectron. Reliab. 48 (4) (2008)
M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectron. Reliab. 47 (12) (2007)
M. H. Lin, C. C. Lo
A location-based incentive pricing scheme for tree-based relaying in multi-hop cellular networks. Integrated Network Management (2005)
M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang
Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectron. Reliab. 45 (7-8) (2005)