K. C. Su

Publication Activity (10 Years)

Years Active: 2002-2020
Publications (10 Years): 1

Top Topics

Top Venues

Publications

Clement Huang, Alex Juan, K. C. Su
Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. IRPS (2020)
M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectron. Reliab. 47 (12) (2007)
M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang
Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectron. Reliab. 45 (7-8) (2005)
H. K. Dai, K. C. Su
Locality Performance of Some Mesh-indexings. PDPTA (2002)