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Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects.

Clement HuangAlex JuanK. C. Su
Published in: IRPS (2020)
Keyphrases
  • thin film
  • electron microscopy
  • high density
  • grain size
  • short circuit
  • solar cell
  • input output
  • multi layer
  • white light interferometry
  • viewpoint
  • control system
  • low density
  • room temperature