Login / Signup
Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment.
M. H. Lin
Y. L. Lin
K. P. Chang
K. C. Su
Tahui Wang
Published in:
Microelectron. Reliab. (2005)
Keyphrases
</>
user interface
significant improvement
user friendly
high speed
data sets
energy consumption
interface design