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A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.

Y. H. LinC. C. LeeC. Y. LiaoM. H. LinW. C. TuRobin ChenH. P. ChenWinston S. ShueMin Cao
Published in: IRPS (2023)
Keyphrases
  • process model
  • multiscale
  • expert systems
  • input output
  • databases
  • artificial intelligence
  • three dimensional
  • relational databases
  • evolutionary algorithm
  • domain knowledge