Lokesh Siddhu

Publication Activity (10 Years)

Years Active: 2014-2024
Publications (10 Years): 10

Top Topics

Ibm Zenterprise

Special Session

Dynamically Created

Top Venues

ACM Trans. Embed. Comput. Syst.

ACM Trans. Design Autom. Electr. Syst.

Publications

Shailja Pandey, Lokesh Siddhu, Preeti Ranjan Panda
NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching. ACM Trans. Design Autom. Electr. Syst. 29 (1) (2024)
Jörg Henkel, Lokesh Siddhu, Lars Bauer, Jürgen Teich, Stefan Wildermann, Mehdi B. Tahoori, Mahta Mayahinia, Jerónimo Castrillón, Asif Ali Khan, Hamid Farzaneh, João Paulo C. de Lima, Jian-Jia Chen, Christian Hakert, Kuan-Hsun Chen, Chia-Lin Yang, Hsiang-Yun Cheng
Special Session - Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications. CASES (2023)
Lokesh Siddhu, Hassan Nassar, Lars Bauer, Christian Hakert, Nils Hölscher, Jian-Jia Chen, Jörg Henkel
Swift-CNN: Leveraging PCM Memory's Fast Write Mode to Accelerate CNNs. IEEE Embed. Syst. Lett. 15 (4) (2023)
Lokesh Siddhu, Aritra Bagchi, Rajesh Kedia, Isaar Ahmad, Shailja Pandey, Preeti Ranjan Panda
Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure. ACM Trans. Embed. Comput. Syst. 22 (6) (2023)
Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. ACM Trans. Archit. Code Optim. 19 (3) (2022)
Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda
CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance. DATE (2022)
Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. CoRR (2021)
Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda
Leakage-Aware Dynamic Thermal Management of 3D Memories. ACM Trans. Design Autom. Electr. Syst. 26 (2) (2021)
Lokesh Siddhu, Preeti Ranjan Panda
PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor. ACM Trans. Embed. Comput. Syst. 18 (5s) (2019)
Lokesh Siddhu, Preeti Ranjan Panda
FastCool: Leakage Aware Dynamic Thermal Management of 3D Memories. DATE (2019)
Lokesh Siddhu, Amit Mishra, Virendra Singh
Operand Isolation with Reduced Overhead for Low Power Datapath Design. VLSI Design (2014)