Brendan Farley

Publication Activity (10 Years)

Years Active: 2013-2023
Publications (10 Years): 11

Top Topics

Division Multiple Access

Semiconductor Devices

Heterogeneous Sources

Top Venues

IEEE J. Solid State Circuits

Publications

Brendan Farley
Software Abstraction of Next Generation Radio Access Networks. ESSCIRC (2023)
Umanath Kamath, Edward Cullen, Tao Yu, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski
A 1-V Bandgap Reference in 7-nm FinFET With a Programmable Temperature Coefficient and Inaccuracy of ±0.2% From -45°C to 125°C. IEEE J. Solid State Circuits 54 (7) (2019)
Umanath Kamath, Tao Yu, Wei Yao, Edward Cullen, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski
BJT Device and Circuit Co-Optimization Enabling Bandgap Reference and Temperature Sensing in 7-nm FinFET. ESSDERC (2018)
Didem Turker, Ade Bekele, Parag Upadhyaya, Bob Verbruggen, Ying Cao, Shaojun Ma, Christophe Erdmann, Brendan Farley, Yohan Frans, Ken Chang
A 7.4-to-14GHz PLL with 54fsrms jitter in 16nm FinFET for integrated RF-data-converter SoCs. ISSCC (2018)
Umanath Kamath, Edward Cullen, John Jennings, Ionut Cical, Darragh Walsh, Peng Lim, Brendan Farley, Robert Bogdan Staszewski
A 1 V Bandgap Reference in 7-nm FinFET with a Programmable Temperature Coefficient and an Inaccuracy of ±0.2% from -45°C to 125°C. ESSCIRC (2018)
Christophe Erdmann, Bob Verbruggen, Bruno Vaz, Roberto Pelliconi, John McGrath, Ryan Kinnerk, Ronnie De La Torre, John O'Dwyer, Patrick Lynch, Padraig Kelly, Peng Lim, Daire Breathnach, Brendan Farley
A modular 16NM Direct-RF TX/RX Embedding 9GS/S DAC and 4.5GS/S ADC with 90DB Isolation and Sub-80PS Channel Alignment for Monolithic Integration in 5G Base-Station SoC. VLSI Circuits (2018)
Bruno Vaz, Bob Verbruggen, Christophe Erdmann, Diarmuid Collins, John McGrath, Ali Boumaalif, Edward Cullen, Darragh Walsh, Alonso Morgado, Conrado Mesadri, Brian Long, Rajitha Pathepuram, Ronnie De La Torre, Alvin Manlapat, Georgios Karyotis, Dimitris Tsaliagos, Patrick Lynch, Peng Lim, Daire Breathnach, Brendan Farley
A 13Bit 5GS/S ADC with Time-Interleaved Chopping Calibration in 16NM FinFET. VLSI Circuits (2018)
Brendan Farley, John McGrath, Christophe Erdmann
An All-Programmable 16-nm RFSoC for Digital-RF Communications. IEEE Micro 38 (2) (2018)
Christophe Erdmann, Edward Cullen, Damien Brouard, Roberto Pelliconi, Bob Verbruggen, John McGrath, Diarmuid Collins, Marites De La Torre, Pierrick Gay, Patrick Lynch, Peng Lim, Anthony Collins, Brendan Farley
16.3 A 330mW 14b 6.8GS/s dual-mode RF DAC in 16nm FinFET achieving -70.8dBc ACPR in a 20MHz channel at 5.2GHz. ISSCC (2017)
Bruno Vaz, Adrian Lynam, Bob Verbruggen, Asma Laraba, Conrado Mesadri, Ali Boumaalif, John McGrath, Umanath Kamath, Ronnie De La Torre, Alvin Manlapat, Daire Breathnach, Christophe Erdmann, Brendan Farley
16.1 A 13b 4GS/s digitally assisted dynamic 3-stage asynchronous pipelined-SAR ADC. ISSCC (2017)
Brendan Farley, Christophe Erdmann, Bruno Vaz, John McGrath, Edward Cullen, Bob Verbruggen, Roberto Pelliconi, Daire Breathnach, Peng Lim, Ali Boumaalif, Patrick Lynch, Conrado Mesadri, David Melinn, Kwee Peng Yap, Liam Madden
A programmable RFSoC in 16nm FinFET technology for wideband communications. A-SSCC (2017)
Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden
A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters. IEEE J. Solid State Circuits 50 (1) (2015)
Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden
6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. ISSCC (2014)
Marco Casale-Rossi, Patrick Leduc, Giovanni De Micheli, Patrick Blouet, Brendan Farley, Anna Fontanelli, Dragomir Milojevic, Steve Smith
Panel: "will 3D-IC remain a technology of the future... even in the future?". DATE (2013)