A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters.
Christophe ErdmannDonnacha LowneyAdrian LynamAidan KeadyJohn McGrathEdward CullenDaire BreathnachDenis KeanePatrick LynchMarites De La TorreRonnie De La TorrePeng LimAnthony CollinsBrendan FarleyLiam MaddenPublished in: IEEE J. Solid State Circuits (2015)
Keyphrases
- data sets
- data collection
- data structure
- raw data
- data processing
- prior knowledge
- data quality
- database
- distributed data
- original data
- computer systems
- input data
- knowledge discovery
- data analysis
- high quality
- training data
- image processing
- big data
- data mining techniques
- heterogeneous data
- signal processing
- low cost
- general purpose
- real time