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6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters.

Christophe ErdmannDonnacha LowneyAdrian LynamAidan KeadyJohn McGrathEdward CullenDaire BreathnachDenis KeanePatrick LynchMarites De La TorreRonnie De La TorrePeng LimAnthony CollinsBrendan FarleyLiam Madden
Published in: ISSCC (2014)
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