Innovative packaging technique for backside optical testing of wire-bonded chips.

Alberto Tosi Franco Stellari Franco Zappa

Published in: Microelectron. Reliab. (2005)

Keyphrases

high speed
high density
wire bonding
bond pad
integrated circuit
test cases
test data
software testing
stress response
databases
data mining
computer systems
experimental data
electron beam
optical imaging
closely spaced