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Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding).
Andrew J. G. Strandjord
Scott Popelar
Christine Jauernig
Published in:
Microelectron. Reliab. (2002)
Keyphrases
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wire bonding
thin film
electron microscopy
stress response
printed circuit boards
bond pad
silicon nitride
semiconductor devices
high temperature
electrical properties
high density
mechanical properties
magnetic field
multi layer
failure rate
visual inspection
neural network