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Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits.

Abhishek KoneruSukeshwar KannanKrishnendu Chakrabarty
Published in: ACM J. Emerg. Technol. Comput. Syst. (2017)
Keyphrases
  • integrated circuit
  • printed circuit boards
  • electron beam
  • test set
  • test cases
  • real time
  • high impact
  • critical path
  • database
  • data sets
  • genetic algorithm
  • test data
  • software testing
  • defect detection
  • user perceived