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Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits.
Abhishek Koneru
Sukeshwar Kannan
Krishnendu Chakrabarty
Published in:
ACM J. Emerg. Technol. Comput. Syst. (2017)
Keyphrases
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integrated circuit
printed circuit boards
electron beam
test set
test cases
real time
high impact
critical path
database
data sets
genetic algorithm
test data
software testing
defect detection
user perceived