On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits.
Roshan WeerasekeraMatt GrangeDinesh PamunuwaHannu TenhunenPublished in: DATE (2010)
Keyphrases
- integrated circuit
- metal oxide semiconductor
- cmos technology
- input output
- low cost
- high density
- high speed
- electron beam
- low power
- power consumption
- power dissipation
- silicon dioxide
- liquid crystal
- printed circuit boards
- traffic engineering
- real time
- fiber optic
- semiconductor devices
- transmission electron microscopy
- plasma etching
- space charge
- lower cost